Unmatched in Wafer Production and Handling.
3M brings precision, efficiency and performance to your manufacturing process.
Semiconductors
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Improving Semiconductor Processing and Handling
If you are involved in semiconductor production and handling, you should be partnering with 3M. Our expertise in areas like microreplication, nanotechnology and molding provide solutions which help enable the uniformity and precision your processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from CMP and surface finishing materials for wafer processing to fluids for thermal management to tape and reel for chip transport.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
Product Categories
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CMP and Surface Finishing Materials3M CMP and surface finish materials can help you increase productivity, improve yields and provide the high quality process performance your applications require.
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Electronic Assembly Liquid Adhesives
Enjoy the design freedom to reduce assembly times and increase recyclability with our rapid bond, high strength liquid adhesive solutions.
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Tape and ReelGet reliable pocket protection for shipping and storage that meet your component protection requirements and increase productivity.
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Test and Burn-In SocketsReliable performance for testing and burn-in applications.
Product Feature: Pad Conditioners
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The 3M™ Trizact™ Brand
3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.
